Bookmark and Share Printer-friendly version Email to a Friend

Physical Layer Reference Stack for UMTS Femtocell Products Supports up to 32 Users

(Top News, 19 Feb 2010 )

Texas Instruments Inc. (TI) announced the availability of a 3GPP voice and data physical layer reference stack for UMTS femtocell products designed for Release 6 and 7 compliance. Based on TI’s System-on-a-Chip (SoC) solutions, the new platform is developed in collaboration with Azcom Technology and Nash Technologies. The scalability of TI’s SoCs and PHY libraries, and Azcom’s and Nash’s femtocell physical layer software, along with services from system integration to field support, will allow equipment manufacturers to quickly develop picocell and femtocell products for the enterprise and residential markets.

“As the femto market expands and customers’ requirements evolve, TI continues to invest in DSP and analog solutions, as well as PHY libraries, to support the infrastructure vendors deploying our solutions worldwide,” said Dr. Arnon Friedmann, strategic and technical marketing manager, wireless base station infrastructure business, Texas Instruments. “With Azcom and Nash using our libraries as the foundation for their high performing PHY layer software, OEMs can benefit from more efficient processing with a standards-based proven set of code and platform extensibility, ultimately getting to market more quickly.”

The UMTS voice and data femto PHY addresses the need for a ready to use, fully featured and high capacity UMTS femto NodeB software stack, which is fully customizable and compatible with industry standards. It is designed to operate on TI’s high-performance processors with an initial implementation on the TMS320TCI648x series of wireless base station infrastructure devices. The Femto PHY Processing Layer provides highly performing receive and transmit functionalities. The proprietary rake receiver gains advantage from hardware acceleration offered by TI provides best-in-class channel processing capacity.

The reference design supports up to 32 AMR calls and up to 16 HSxPA served users, and is fully compliant to Femto Forum API.

Texas Instruments

Azcom Technology

Nash Technologies


RELATED ARTICLES
Smallest Class-D Audio Amplifier Rated at 3.2W

Charging a Critical Issue, Says TI’s Papermaster

Multi-channel, 16-bit ADCs Feature 500kSps Throughput

TI revolutionizes design of wireless networking apps with eZ430-Chronos

14-bit ADCs consume 275mW per channel at 250MSps

12V Dual-channel Synchronous Buck Converter Features Integrated FETs

 
Printer-friendly version Email to a Friend
Article Rating 
Average Rate: No rating yet
 
Poor Quite Good Good Very Good Excellent
 
 
Related Content 
 
 
ADVERTISEMENT
 
 
ON-DEMAND WEBCASTS

 
Highest Rated  
 
 
 
 
ADVERTISEMENT
 
 


TECHNOLOGY NEWS
 
 
 
PRODUCT NEWS
 
FEATURED SPONSORS
 
 
 
DESIGN CENTERS
 
ADVERTISEMENT
 
     
CURRENT ISSUE
 
COVER STORY:

Analog design in the 21st century: challenges, tools, and IC advances

We are now more than a decade into the 21st century, and on an ever-accelerating fast track to technological innovation in electronics. The transistor and progression into the IC, or microchip, lit the fuse leading to the explosion of innovations in electronics that is now taking place. Since the wi ...
HIGHLIGHTS:
SPECIAL REPORT
DESIGN FEATURES
 
PULSE
 
 
 
 


 


RSS
   
   
   
   
   
   
   
   
   
   
   
   
   
   
   
   
   
   
   
   
   

POLL
What type of environmental regulation do you think will be most beneficial for the tech industry?
Proper recycling and disposal
Push for power efficiency and energy conservation
Chemical/lead regulation
View results

 
 
 
 
 
 
Power Technology E-newsletter 
Power.org Releases Power Architecture 32-bit Application Binary Interface Supplement
EDNA, May 11
POL Regulators Designed for Energy-efficient Computing
EDNA, March 11
Fairchild Revolutionizes Power Savings
EDNA, January 11
Lattice Transforms Board Power and Digital Management
EDNA, November 10
 
Analog E-newsletter 
12V Dual-channel Synchronous Buck Converter Features Integrated FETs
EDNA, February 10
Power MOSFETs features reduced top-side thermal impedanc
EDNA, January 10
 

 
KNOWLEDGE CENTER
 
Texas Instruments: DaVinci™ Technology
 
Texas Instruments: Safe Bet Series
 
 
INDUSTRY LINKS
 
Photonics Association (Singapore)
Singapore Industrial Automation Association (SIAA)
Taiwan Semiconductor Industry Association (TSIA)
 
 
 
 
OUR SPONSORS
 







Keithley Instruments
With more than 60 years of measurement expertise, Keithley Instruments has become a world leader in advanced electrical test instruments and systems from DC to RF (radio frequency). Our products solve emerging measurement needs in production testing, process monitoring, product development, and research...
 
 
 
     
 

EDN India | EDN Taiwan | EDN Korea | EDN Japan | EDN China | EDN | EDN Europe

 
ABOUT EDN Asia | | CONTACT US
   
© 2012 EDN Asia All rights reserved.