STMicro puts up to 8 dies in multi-chip package

STMicroelectronics’ 1.6mm BGA (Ball Grid Array) contains as many as eight stacked memory chips. Designed to help satisfy the ever-increasing demand for more memory in smaller volume, these multi-chip package (MCP) devices contain between two and four chips, often representing different types of memory such as SRAM, Flash, or DRAM, already widely used in products such as mobile phones where space is at a premium. By literally stacking two or more chips on top of each other, the space required on the printed circuit board is the same as would be needed for a single chip—and because memory chips use many common signals, such as address and data bus lines, the number of connections between the package and the board is almost the same.

STMicroelectronics
Fax 41-22-929-29-00
www.st.com