Elpida Memory Inc. and Hiroshima Elpida Memory Inc. announced the completion of its new 300 mm production line at its 300 mm wafer fabrication facility (E300 Fab) in Hiroshima, Japan. The monthly 300 mm wafer production volume is expected to reach a capacity of 54,000 by FY Q4. The company claims that it would make Hiroshima Elpida's E300 Fab the largest semiconductor wafer processing capacity in Japan.
Shuichi Otsuka, president, Hiroshima Elpida, said, ˇ°Our first lot of wafers for mass production of DRAM using advanced 90 nm process technology started on October 17, 2005,ˇ± he added, ˇ°Our initial ramp has been extremely smooth and successful, and each day we are seeing an increase in the number of wafers processed.ˇ±
The company claims that the production yield based on Elpida's 90 nm process technology has been outstanding since the start of mass production, and Elpida intends to have advanced 90 nm process technology account for approximately 70% of total monthly production at the E300 Fab within this fiscal year.
Elpida Memory Inc.
