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Atmel announces high-voltage CMOS foundry process with high-density EEPROM

(Technology News, 13 Jul 2006 )
By Vinod Kataria

Atmel Corporation, in the development and fabrication of advanced semiconductor solutions, has released AT35700 high-voltage process technology with double-poly, high-density EEPROM for IC foundry customers. This 0.35um technology has LDMOS transistors capable of 17V and 40V operation and has a 5.0V low-leakage CMOS core. The low-leakage CMOS has been engineered to minimize sub-threshold leakage currents making this technology for portable electronic devices. Isolated NMOS and LDMOS transistors are included to minimize circuit noise. A large selection of on-chip analog resistors and capacitors are included to reduce off-chip component requirements. The technology supports placement of ESD and I/O transistors under the bond pads, thus minimizing the die size.

This high-voltage process technology is for mixed-signal, power management, motor and motion control, and automotive monitoring and control applications. These applications can be expanded with design solutions enhanced with Atmel's industry standard, workhorse AVR microcontroller line.

Atmel

 
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