Rudolph Technologies Inc., provider of process control equipment for thin film measurement and macro defect inspection, has announced the first shipment of an advanced all-surface macro defect detection system to a leading US-based flash memory manufacturer. The system, which will be installed in a quality assurance environment, combines the wafer frontside inspection capability of the fast, new AXi 935 Macro Defect Inspection tool with the edge inspection capability of the recently-introduced E25 Wafer Edge Inspection module.
Ardy Johnson, vice president of marketing for Rudolph, said, "The AXi 935 is the next generation in the AXi line, complementing the widely adopted AXi 930, and offers significantly higher throughput while still maintaining the high resolution advanced macro inspection capability customers have come to rely on. The combination of the AXi 935 and E25 on a single platform accommodates automatic inspection of both the front surface and edge of the wafer in a single system without significantly impacting inspection throughput. The inspection data can be fed forward for automatic disposition of both wafers and die for quality assurance."
Rudolph Technologies
