VIA Technologies Inc, developer of silicon chip technologies and PC platform solutions, announced the VIA VX700 chipset to build on the success of the VIA ultra mobile platform in UMPC devices, enabling reduction of mobile form factors by up to 40%.
Chinhwaun Wu, special assistant to the president, processor platform product marketing, VIA Technologies, said, "The VIA VX700 sets a new industry milestone for functionality and performance in a single chipset package. Together with the VIA C7-M processor, VIA can now offer a platform that breaks form factor barriers while maintaining comprehensive performance, a leading feature set, and ultra-low power operation for longer battery life."
Rob Howe, president of DualCor Technologies, stated, "The VIA VX700 chipset together with the VIA C7-M ULV processor has enabled us to create a new convergence device that combines the convenience of a digital communications device, with the power of a conventional PC in a thin, elegant machine. The VIA Ultra Mobile platform featuring the VIA VX700 has been critical in helping us achieve the cPC's small size and enhanced battery life, while still providing the performance that today's mobile user needs for everyday PC tasks."
DualCor Technologies VIA Technologies
