Advanced Micro Devices (AMD) announced that its Torrenza Initiative is serving as a collaborative force toward achieving future processor socket compatibility in the server industry. By leveraging the advantages of AMD64 with Direct Connect Architecture and HyperTransport technology, OEMs will be able to standardize on a Torrenza Innovation Socket for many of their current and future server platforms. It is said that this approach to server design will enable OEMs to consolidate server offerings for multiple processors to potentially a single platform, reducing datacenter disruption and deployment costs for customers. The Torrenza initiative is establishing AMD64 as the Open Innovation Platform.
Leading server OEMs that develop silicon or intend to design products uniquely enabled by the Torrenza Initiative, including Cray, Fujitsu Siemens Computers, HP, IBM, Dell and Sun Microsystems, have endorsed Torrenza as an open innovation initiative, and plan to evaluate the Torrenza Innovation Socket.
Marty Seyer, senior vice president, commercial segment, AMD, said, “This next phase in the Torrenza initiative would not be possible without the enthusiasm and desire of our partners to enable open innovation and greater collaboration across the computing ecosystem. Together, we recognize that the impact of Torrenza can be far-reaching across the industry in reducing complexity for customers while increasing the pace of innovation both in silicon and platforms. Datacenter managers will immediately recognize the impact of the Torrenza open environment, and benefit from the enhanced cooperation at the platform level, with new levels of platform stability, upgradeability, flexibility, and capabilities for their server infrastructure.”
Advanced Micro Devices
