Fairchild Semiconductor's 50A- and 75A-rated Motion-SPM devices target 5 to 7.5kW commercial and industrial inverter motor designs.
The FSAM50SM60A (600V/ 50A) and FSAM75SM60A (600V/ 75A) modules in 6031mm dual inline packages (DIP) occupy virtually half the board space of discrete solutions. Utilizing direct bonded copper (DBC) substrate technology, SPM packages provide excellent thermal resistance and heat transfer capability. These devices offer designers a highly integrated, simplified approach to applications requiring higher efficiency and performance characteristics such as air conditioners and servo drivers used in factory automation.
Each Motion-SPM integrates six IGBTs, six freewheeling diodes, three HVICs, one LVIC and one thermistor in one compact module. The built-in HVICs provide a singlegrounded power supply for optocoupler-less interface, while the low-side sense IGBTs provide adjustable short-circuit current protection. Each module also offers integrated sensorless control and temperature monitoring. An integrated thermistor monitors overtemperature conditions.
The devices are lead (Pb)-free products and compliant with EU requirements.
Fairchild Semiconductor, www.fairchildsemi.com
