Free Print Subscription Printer-friendly version Email to a Friend

Hybrid board with four DSP processing cluster

( 01 Oct 2006 )



The first of a new line of hybrid embedded boards, the GT3U (GT-3UcPCI) features an Altera Stratix II GX FPGA, a four-DSP-TS201S-TigerSharc processor cluster, and 1Gbyte of DDR2 SDRAM. These processing clusters provide 14.4 GFLOPS of floating-point and 57.5 BOPS of 16-bit fixed-point processing power per board. Providing software support for the device, the vendor’s tools include host-interface libraries, diagnostic utilities, and configuration tools. Also available are the TS-Lib optimized libraries for TigerSharc; a board-support-package for Gedae; and third-party tools supporting the hybrid embedded boards, including Analog Devices’ VisualDSP++ and targets for the Mathworks’ Matlab and Simulink. BittWare Inc., www.bittware.com

 
Free Print Subscription Printer-friendly version Email to a Friend
Article Rating 
Average Rate: No rating yet
 
Poor Quite Good Good Very Good Excellent
 
 
Related Content 
 
 
WEBCASTS
 
KNOWLEDGE CENTER
Panasonic Key Devices Guide 2008:
 
Fairchild Semiconductor :
 
 
Highest Rated  
 
Feedback Loop  
 
 
 
ADVERTISEMENT
Press Release 
 
TECHNOLOGY NEWS
 
RESOURCE CENTER


 
 
PRODUCT NEWS
 
FEATURED SPONSORS


 
 
 
DESIGN CENTERS
 
ADVERTISEMENT
     
Reference Designs 
   
     
 
 
 

 
 
RSS
   
   
   
   
   
   
   
   
   
   
   
   
   
   
   
   
   
   
   
   
   

POLL
What type of environmental regulation do you think will be most beneficial for the tech industry?
Proper recycling and disposal
Push for power efficiency and energy conservation
Chemical/lead regulation
View results
 
Outlook and Trends 2008


 

Reed Electronics Group | Reed Business Information Asia |
EDN India | EDN Taiwan | EDN Korea | EDN Japan | EDN China | EDN | EDN Europe
ECN Asia | ECN Taiwan | ECN Korea | ECN China | EB Asia | WDDA | WDDA Taiwan | WDDA China

 
ABOUT EDN Asia | FREE SUBSCRIPTION | CONTACT US
   
© 2008 Reed Business Information, a division of Reed Elsevier Inc.
All rights reserved. Use of this web site is subject to its Terms and Conditions of Use. View our Privacy Policy.