Infineon introduces test chip to eliminate VIA defects
(Top News, 14 Nov 2006 )
By Vinod Kataria
Infineon said that it has become the first semiconductor manufacturer in the world to introduce a method that can avoid one of the most common causes of defects in the production of highly integrated semiconductor circuits: the electrical failure of vertical interconnect (VIA) contacts. VIA refers to the contact between two metal layers in integrated circuits. Infineon developed the new method in collaboration with the Regensburg University of Applied Sciences (FH Regensburg) as part of its automotive excellence program, launched some three years ago to meet the automotive industry’s exacting quality requirements.
Elfriede Geyer, vice president quality management at the automotive, industrial & multimarket business group of Infineon, said, "Optimal security can only be ensured by delivering the highest product quality. Our automotive excellence program aims to deliver zero-defect products and is the most comprehensive quality management program in the industry. What sets Infineon’s initiative apart from conventional quality management programs is its holistic approach, which includes elements such as production in company-owned facilities that have been specifically optimized for product quality. The core of our Automotive Excellence program is: No rework!”
The test chip maps an arrangement of more than half a million VIA cells, with each cell containing both the VIA to be evaluated and the associated control electronics. The electrical resistance and voltage drop are measured and then used as parameters to establish whether a VIA is defective, and, if so, where the source of the defect lies.
Infineon is currently using the VIA test chip primarily for components being manufactured in 0.5µm and 130-nanometer technology, e.g. the AUDO NG microcontroller, which uses 130-nanometer embedded flash technology. Infineon is confident that the VIA test chip will also be suitable for future technologies such as 90- and 65 nanometers.
Geyer, stated, "The VIA test chip is a unique method for determining VIA reliability. It lets us measure the reliability of VIAs by screening their quality on a permanent basis and by selectively analyzing conspicuous VIAs. That allows us to avoid defects right from the start. Infineon technologies perfected by VIA test chip monitoring will stand out from competing products thanks to their significantly higher quality, manifest in significantly lower dpm (defects per million)."
