Altera corporation and White Electronic Designs Corporation (WEDC), manufacture of high technology components, announced a partnership that will enable military and aerospace customer access to a variety of packaging options for FPGAs that meet requirements of defense applications.
WEDC will package Altera FPGA die in packaging types that will include form factor monolithic plastic and ceramic, chip-on-board, multichip modules, stack and system-in-a-package (SiP). The packaging options will support Altera’s 90-nm Stratix II and Cyclone II FPGA families. Support for Altera’s next-generation, 65-nm FPGAs is also planned. WEDC’s secure facilities and technologies for defense related programs will ensure the security of customers’ designs when they send their die for packaging.
Hamid Shokrgozar, chairman and CEO at WEDC, said, "This relationship further demonstrates commitment to defense electronics OEMs. It brings FPGA capabilities to military systems designers in smaller form factor packaging for applications requiring high density and design flexibility than standard packaging allows."
WEDC
