Teradyne Inc. and Staccato Communications Inc., in the Ultra Wideband (UWB) communications market, announced that the FLEX Test Platform has been specified for the production ramp of Staccato’s Ripcord product family based on Certified Wireless USB.
Ken Molitor, vice president of operations for Staccato Communications, said, "With the final stages of worldwide regulatory approval and logo certification imminent, we are preparing a steep production ramp of Certified Wireless USB based silicon. Our choice of the FLEX Platform for ATE and our collaboration with Teradyne enables the most efficient path for volume production. We selected Teradyne’s factory-supported FLEX Test Platform systems because they are widely deployed, highly scalable, and their multisite test capability ensures fast manufacturing test times resulting in lowest test costs of our Ripcord single-chip, all-CMOS product family."
David Trounson, general manager, semiconductor test wireless business unit, Teradyne, stated, “Teradyne’s goal is to enable efficiencies in test that result in the lowest cost and highest throughput to meet the needs of Staccato’s aggressive production ramp. Staccato is well positioned in the market with an advanced product roadmap that extends to next-generation dual-band silicon that maintains low cost, small form-factor and low power consumption products for Certified Wireless USB and Bluetooth 3.0. By joining ’Team Staccato,’ Teradyne reinforces our commitment to the growing industry of Certified Wireless USB and WiMedia UWB.”
Staccato CommunicationsTeradyne
