New Products

MIMO precoding and channel coding added to 3GPP LTE signal generators

(EDN Asia, 1 Jun 2008)
Rohde & Schwarz has added channel coding and MIMO precoding for up to four transmit antennas to its signal generators for 3GPP LTE (uplink and downlink). Targeted at mobile equipment manufacturers looking ....
 

250kHz 16-bit data acquisition cards for PCI Express

(EDN Asia, 1 Jun 2008)
These 250kHz 16-bit data acquisition cards are designed for PCI Express. The UF2e-4721 has 16 analog inputs and the UF2e-4020 has 8 channels. Features include the options for dual-timebase sampling, synchronous ....
 

Complete support for W-CDMA A-GPS conformance testing

(EDN Asia, 1 Jun 2008)
The Aeroflex 6401 AIME A-GPS supports industry-standard TTCN A-GPS protocol test cases, as well as the Minimum Performance tests and the OMA (Open Mobile Alliance) SUPL V1.0 (Secure User Plane Location) ....
 

Power Metal Strip resistors offer low resistance values

(EDN Asia, 1 Jun 2008)
These high-temperature, surface-mount Power Metal Strip resistors are said to be the industry’s first devices in the 3921 and 5931 case sizes to offer an operating temperature range of 65° to +275°C. ....
 

Subminiature connectors enable board-to-board spacing of 3mm

(EDN Asia, 1 Jun 2008)
ERNI Electronics has expanded its MicroStac SMT connector series to include a 0.8mm grid with 9- and 14-pin versions. With the introduction of the 9-pin design, board-to-board spacing of only 3mm is now ....
 

MINIPAK HDE connector for demanding environments

(EDN Asia, 1 Jun 2008)
Tyco Electronics’ MINIPAK HDE connector is a high current power module designed to complement the compay’s high-speed backplane connectors including Z-PACK HM-Zd, Z-PACK TinMan and MULTIGIG RT connectors. ....
 

Ultra-miniature, half pitch, side-actuated DIP switch

(EDN Asia, 1 Jun 2008)
The TDP Series is one of the first ultra-miniature, surface mount, half pitch, side-actuated DIP switches available in the industry. Its high reliability, low profile and mounting options make it ideal ....
 

ERmet ZD plus family for high-speed designs

(EDN Asia, 1 Jun 2008)
ERNI Electronics has developed a high-speed, differential, board-to-backplane electrical connector system. The product is an enhancement of the proven ERmet ZD family which got high market acceptance ....
 

Cost effective solution for high-density performance

(EDN Asia, 1 Jun 2008)
The Z-PACK TinMan backplane connector is a cost-effective solution for system designers searching for a high-density, high-performance backplane interconnect system capable of operating at 10 to 12.5Gb/s. ....
 

Temperature-compensated resistor for APD biasing in fiber optic modules

(EDN Asia, 1 Jun 2008)
The DS1841 temperature-compensated resistor is optimized for avalanche photodiode (APD) voltage control. This I2C-controlled, 128-position digital resistor utilizes a logarithmic scale specifically designed ....
 
 
Previous   1    2    3    4    5    6    [7]    8    Next
 
 
ADVERTISEMENT
 
TECHNOLOGY NEWS
 
RESOURCE CENTER
 
 
PRODUCT NEWS
 
FEATURED SPONSORS


 
 
 
DESIGN CENTERS
 
ADVERTISEMENT
     
Reference Designs 
   
     
 
 
 

 
 
RSS
   
   
   
   
   
   
   
   
   
   
   
   
   
   
   
   
   
   
   
   
   

POLL
How do you expect your company to perform this year?
Worse than last year
Same as last year
Better than last year
View results
 
Outlook and Trends 2008