Dialog Semiconductor has rolled out a power management IC (PMIC) chipset for use in Renesas's R-Car H3 automotive computing platform for driving support systems and in-vehicle infotainment systems.

Scalable and flexible, the PMIC chipset is made of the DA9063-A system PMIC and two sub PMICS, the DA9213-A and DA9214-A. It delivers 14% lower power dissipation compared to competing PMICs, according to Dialog. That reduction combined with the multi-rail support, in-system reprogrammable power sequencing offered via the complementary SmartCanvas GUI, dynamic voltage scaling and over-temp and over-voltage shut down, allows optimum flexibility in a market leading power solution, the company said.

Dialog’s partitioning into system and sub PMICs offers the advantages of scalability and flexibility while distributing the power dissipation in adverse temperature environments. The R-Car H3 platform will benefit from this flexibility because different SoC implementations require different combinations of system and sub PMICs, depending on the end application, according to the company.