Vishay Semiconductors’ P1xP holder enables pin-in-paste soldering to eliminate the wave-soldering step for through-hole devices.
Vishay Intertechnology has introduced the side-view metal holder for the company's TSOP33xxx and TSOP53xxx series of miniature Minimold infrared receiver modules for infrared remote control applications. The Vishay Semiconductors P1xP holder enables pin-in-paste soldering to reduce assembly costs and increase reliability.
Vishay's Minimold devices supply high sensitivity with typical irradiance of 0.08mW/m² at 0° of the TSOP33xxx series and 0.12mW/m² for the TSOP53xxx series. The Minimold package is also available with "F" option for an enhanced optical filter against out-of-band optical noise, while TSOP53xxx series devices are highly resistant to RF interference. RoHS-compliant, halogen-free, and Vishay Green, the devices are also available in a top-view surface-mount version.
Designers continue to replace through-hole devices requiring wave soldering with higher-temperature equivalent, pin-in-paste technology has emerged as a cost-effective method for mounting the components—together with surface-mount packages—via reflow soldering. In the pin-in-paste process, after components are positioned on the PCB, the entire board is soldered at once using only the reflow oven, eliminating the wave-soldering step for through-hole devices. The holder released is available for PCBs with thicknesses from 1.0mm to 1.6mm.
Featuring the three-point, surface-mount solderable tabs, the P1xP reduces the number of automatic insertion points while improving co-linearity and grounding for better RF and EMI rejection. Dry-packed in stiff plastic trays for automatic pick-and-place assembly, the holders feature a large pick-and-place area and clips to securely hold the IR receiver module.