EDN Asia - Digital Den

Spaced Out on HiRel

Wed, 17 Mar 2010 00:00:00 +0800

The heavens have fascinated people since the beginning of mankind. Space travel and exploration remain a popular topic to all ages and are the subjects of international debate, pride, strength and domestic ....

Renesas R8C e-Learning Program

Wed, 10 Mar 2010 00:00:00 +0800

The objective of this course is to provide a quick and simple way to learn about the R8C Family of MCUs and the unique benefits it brings to today�s engineers. The R8C series is a result of careful planning and implementation of various design techniques, keeping in mind the present and future requirements of embedded systems.

To equip engineers with the fundamental techniques on how to optimize applications using R8C MCUs, this course is divided into three modules...

Imec, Synopsys to Partner on 3D Stacked IC Development

Wed, 10 Mar 2010 00:00:00 +0800

Synopsys Inc. and the Belgian nanoelectronics research center Imec have entered into a collaboration to use Synopsys TCAD (Technology Computer-Aided Design) finite-element method tools for characterizing ....

11th Annual ISQED to Address Electronic Design Challenges, Trends, and Proven Methodologies

Fri, 5 Mar 2010 00:00:00 +0800

The 11th annual International Symposium on Quality Electronic Design (ISQED), to be held on March 22-24, 2010 at the DoubleTree Hotel in San Jose, California, U.S.A., has just announced its lineup of ....

Carnegie Mellon, Intel Partner to Improve Energy Costs, Efficiency in Chip Making

Fri, 22 Jan 2010 00:00:00 +0800

Carnegie Mellon University and Intel Corp. have unveiled a new class of materials called solder magnetic nanocomposites that could help streamline the process of computer electronic packaging. A Carnegie ....

X-FAB Develops Industry's First Foundry Process Optimized for High-speed Optoelectronic Applications

Tue, 19 Jan 2010 00:00:00 +0800

X-FAB Silicon Foundries expanded its 0.35 micron technology offerings with the first foundry technology optimized for Blu-ray and high-speed optical data communication applications. Dubbed XO035, the ....

NEC Successfully Integrates NanoBridge in the Cu Interconnects of Si LSI

Wed, 16 Dec 2009 00:00:00 +0800

NEC Corp., in collaboration with the National Institute of Materials Science, successfully integrated NanoBridge, a solid electrolyte non-volatile crossbar switch, in Cu interconnects placed on CMOS logic. ....

IBM Reinvents Medical Diagnostic Testing

Mon, 23 Nov 2009 00:00:00 +0800

IBM scientists have created a one-step point-of-care-diagnostic test, based on an innovative silicon chip, that requires less sample volume, is significantly faster, portable, easy to use, and can test ....

EDN China 2009 Innovation Award Results Announced

Thu, 19 Nov 2009 00:00:00 +0800

EDN China, China's leading publication for the electronics design industry, has announced the results of the 2009 EDN China Innovation Award. This year saw a total of 95 companies and 181 ....

Intel, NEC to Collaborate on Supercomputer Technologies

Wed, 18 Nov 2009 00:00:00 +0800

Intel Corp. and NEC Corp. will jointly develop High Performance Computing (HPC) system technologies that will push the boundaries of supercomputing performance. NEC will bring these technologies to market ....

TI to Host eTech Day

Mon, 16 Nov 2009 00:00:00 +0800

Texas Instruments Inc. (TI) will host an interactive online technology day (eTech Day) on November 17, 2009 that will showcase training sessions from a variety of applications within the embedded and ....