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STMicroelectronics, STATS ChipPAC and Infineon to Set New Milestone in Establishing Wafer-Level-Packaging Industry Standard

STMicroelectronics , STATS ChipPAC, and Infineon Technologies AG have signed an agreement to jointly develop the next-generation of embedded Wafer-Level Ball Grid Array (eWLB) technology, based on Infineon痴 first-generation technology, for use in manufacturing future-generation semiconductor packages. ST and Infineon, two of the world痴 leading semiconductor makers, have joined forces with STATS ChipPAC, a leader in advanced three dimensional (3D) packaging solutions, to fully exploit the potential of Infineon痴 existing eWLB packaging technology, ...

 
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August 2008
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Embedded x86: keystone of your non-PC design?

Those of you considering PC building blocks for your non-PC designs would do well to keep in mind, as your counterparts who are veterans of this architecture direction have already learned, that placing your stakes on a PC roll of the dice isn稚 a sure bet. On the one hand, you値l benefit from the t ...
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