Analysis suite features thermal/power co-simulation 6/2/2012

Mentor Graphics Corp. has unleashed the version 8.2 of the HyperLynx suite of analysis tools that claims to deliver more features for optimizing PCB designs. These include 3D full-wave field solving and integrated thermal/power co-simulation analysis capabilities that is imperative for analyzing signal ...

Interconnect solution designed for 10Gbps Ethernet, 16Gbps Fibre Channel applications 19/1/2012

The Molex Inc. enhanced zSFP+ (Small Form-factor Pluggable Plus) SMT 20-circuit connectors deliver high-speed performance in telecom and data communications equipment. Designed for 25Gbps serial channels in high-speed Ethernet and Fibre Channel, the new zSFP+ interconnect assemblies are scalable for ...

Fabricating a high-resolution sensor-to-USB interface 1/2/2012

Developing markets weather economic pains 1/2/2012

Voices: Get off the sidelines 1/2/2012

Taimide invests $1.6 million in joint venture with Arakawa Chemical 17/1/2012

Get off the sidelines 13/1/2012

Developing markets weather economic pains 11/1/2012

HSIC compliance test software suited to real-time oscilloscopes 11/1/2012

Automotive driver assistance system optimized for A/V applications 11/1/2012

Integrated MoCA 2.0 SoC supports higher security levels 9/1/2012

ITRI improves LED light bulb weight 4/1/2012