EDN Asia | Voice of the engineer for news, analysis, opinions, special reports, webinars, whitepapers, reference designs, datasheets, application notes, and discussions around technology, business, industry, products, and designs.

X

Top Stories

Analog

2023-01-31- Bill Schweber

Staying vigilant of circuit and system model flaws

Power Supply

2023-01-30- Bill Schweber

Don’t ignore the need for small, low-capacity batteries

CES 2023

2023-01-30- Majeed Ahmad

The design view from GaN Systems’ booth at CES 2023

Test & Measurement

2023-01-30- Majeed Ahmad

Test and manufacturing synergy and the NI acquisition saga

Design Ideas

2023-01-20- Steve Hageman

My favorite design idea of all time…

Power Tips

2023-01-19- Josh Mandelcorn

Two simple isolated power options for 8W or less

Recommended

Teardown

Dissecting Google’s Pixel Buds Pro earbuds

Electric Vehicles

onsemi and VW Group cement strategic collaboration on SiC tech for next-gen EVs

Semiconductor

EEJA showcases latest plating products at 37th INTERNEPCON JAPAN

GaN/SiC

EPC GaN eToF laser driver IC enables higher density lidar systems

Aerospace

Microchip rad-hard power management device suited to LEO space applications

Power ICs

Infineon divests HiRel DC-DC converter business

Hot Topic

Blog

On-PCB options for catching tones

Editor's Choice

I3C

Fundamentals of I3C interface communication

EE Awards Asia 2022

EE Awards Asia 2022: Celebrating Asia’s Semiconductor and Electronics Innovations and Technologies

EE Awards Asia

TI Bags Five Accolades at EE Awards Asia 2022

EE Awards Asia

Tektronix Wins Best Test & Measurement of the Year Award at EE Awards Asia 2022

EE Awards Asia 2022

Solomon Systech EPD Driver IC Honored at EE Awards Asia 2022

EE Awards Asia

Microchip Technology Earns “Featured IoT Chip Supplier” and “Best MCU/Driver IC of the Year” at EE Awards Asia 2022

heterogeneous integrated circuit

RF heterogenous ICs are making headway

Bulbs

Hot resistance versus cold resistance

3D IC

Analog in 3D ICs and TSVs

Monolithic Power Systems

Resolution explained for magnetic angle sensors

Microphone

Microphones: An abundance of options for capturing tones

ADAS

There’s more to driver monitoring system than pretty pictures

2023 Outlook

A technology forecast for 2023

Shannon Decoder

A much faster alternative to the PWM DAC

Kinara

Boosting embedded AI performance with edge AI processors

heterogeneous integrated circuits

The next radio design frontiers

IFS

Change of guards at Intel Foundry Services

Power

Class 4 power: Coming soon to tech near you

LEARNING STUDIO

Webinars

2022/08/03

MOSFIT: Infineon Automotive MOSFET Riding Innovative Design

Infineon Automotive MOSFET Addressing The Market Development & World Class Quality

Functional Safety and Security in NOR Memories

Calibre Full Chip Integration & Interface flows

XENSIV™ TLE4972 – Infineon coreless current sensor is ideal for xEV applications like traction inverters used in hybrid and battery-driven vehicles, as well as for battery main switches

Downloads

India’s Steady Progress in Building Its ESDM Ecosystem

IoT: Industry Progress, Insights, Components, and Use Cases

Power: Trends, Drivers, and the Latest Developments in Asia’s Power Semiconductor Industry

Innovative Reed Tech

Automotive Electronics

Special Reports

EMC/EMI/ESD

Design PCBs for EMI

Does 5G Pose Health Risks?

New Products

Aerospace

Microchip rad-hard power management device suited to LEO space applications

Power Management

Nordic Semiconductor multi-function PMIC simplifies system design

Power Management

TI battery monitors help improve EV range

Processors/Controllers

NXP enables secure and scalable AI-enabled edge platforms

Power Management

STMicroelectronics automotive-grade devices feature enhanced power densities

IoT

Reyax’s new LoRa modules feature higher sensitivity

GaN/SiC

onsemi’s EliteSiC family features high-efficiency performance

Embedded Systems

STMicroelectronics and eYs3D Microelectronics to highlight 3D stereo-vision camera at CES 2023

Embedded Systems

congatec Computer-on-Modules powered by 13th Gen Intel Core processors

Power ICs

Infineon expands power module family

Power ICs

STMicroelectronics power IC enhances overload management

FPGAs/PLDs

Efinix launches Efinity RISC-V embedded software IDE

Power ICs

STMicroelectronics enhances portfolio of USB Type-C power ICs and STM32 IP

NanoEdge

Embedded AI solutions ease ML development

Space Enhanced Plastic

TI expands rad-hard portfolio

Renesas

Clock generator offers unmatched flexibility

Wireless and Networking

Renesas expands low-power WAN product line

TDK

Position sensor features improved accuracy and functional safety

Renesas

Renesas launches portfolio of automotive radar transceivers

NFC

STMicroelectronics NFC chip eases certification of digital car-key systems

People

STEM

STEM MBAs: Substance or Superficial?

Engineering

Women in Tech: 25 Profiles in Persistence

Engineering

Engineers Developing High-Tech Solutions To Mitigate Natural Disasters, Aid Relief Efforts

Communications

IBM Watson Health builds APIs for diabetes

Ex-Baidu Scientist Blazes AI Shortcut

Automotive

Analysts speak up on Tesla AutoPilot incidents

Medical

10-year effort leads to the ‘wearable doctor’

COVID-19

Industry and crowdsource engineering efforts arise against COVID-19

Automotive

French start-up pursues EV standardisation

Communications

Daring Thailand cave rescue: The technology behind it

Analog

National Geographic TV movie review, ‘Apollo: Missions to the Moon’

PCB Design

A lifetime designing PCBs: Changing roles

Opinion

Analog

Chronicle of 10 analog, power and RF acquisitions in 2021

Aerospace

2022 tech themes: A look ahead

Energy

The fundamental problems with ‘traditional’ power transmission

FPGAs

Sky-rocketing chip prices? Not with embedded FPGA

Supply Chain

Don’t underestimate the passives shortage

Analog

Why envelope tracking is both impressive and scary

Blog

The rise of the remote contractor

Amplifiers/Converters

Is Optical Computing in Our Future?

Blog

A well-known numerical “constant” may need revision

Communications

5G is imminent: A roundup of recent activity

Automotive

5G and autonomous vehicles might not go hand-in-hand

Blog

Blog: Expect the Unexpected with Control Systems

Aerospace

Boeing MAX 8: Enhancing Pilot Training With Technology

Consumer Electronics

2020: A consumer electronics forecast for the year(s) ahead

Communications

Consumer electronics: 60 years into the future

Power Management

Do lithium-ion batteries follow Moore’s Law?

Engineering

Mind of the Engineer 2020: Engineering disciplines continue to merge

Consumer Electronics

A high-end display acquisition for photography aspirations

Design IdeasMore +

My favorite design idea of all time…

The electronic analog of the push-button switcher

A safe adjustable regulator

Transistor ∆VBE-based oscillator measures absolute temperature

TeardownMore +

Dissecting Google’s Pixel Buds Pro earbuds

A deep dive inside a USB flash drive

iJoy’s chase face- and object-tracking widget: A robot or tripod it isn’t

Cisco Linksys’ DPC3008: A DOCSIS 3 cable modem that worked great

5GMore +

Keysight’s technology predictions for 2023

When less is more: Introducing 5G RedCap

Keysight accelerates LBS implementation with combined 5G and GNSS technology

Phased array antennas: From military to 5G

All contents are Copyright © 2023 by AspenCore, Inc. All Rights Reserved.

About Us Privacy Policy Terms of Use Site Map

One Chip Solution to Reduce Time-to-Market with MOTIX™ Motor System IC

The world first IC to combine DC motor control with supply functionalities such as power supply, CAN FD & LIN, offering high integration and high performance with optimized cost for the applications.