Developed with Support of 3M and STMicroelectronics
Fremont (California), Geneva (Switzerland) and St. Paul (Minnesota) – May 15, 2018 – The Life Signal Product platform, the world’s first family of semiconductor chips optimized for mobile and wearable applications in medical and health monitoring for life-critical applications, was introduced by LifeSignals Inc. here. The product family was developed and industrialized in conjunction with STMicroelectronics (NYSE: STM) and 3M (NYSE: MMM) to meet the stringent needs of the medical market.
“The medical world is in desperate need of clinical-grade disposable and reusable wearables for a variety of markets ranging from human monitoring applications such as in-hospital patient monitoring, remote health monitoring, wellness, fitness, worker safety, and senior care, to veterinary healthcare such as pet, equine and livestock monitoring,” said Surendar Magar, LifeSignals CEO and Founder. “We are answering that need. We believe the Life Signal Processor Product family will become a cornerstone of an emerging ‘Internet of Lives’ – serving billions and billions of bodies generating billions and billions of bits of life-changing valuable information every second of every day.”
The LSP family currently consists of two silicon devices and developer support items:
The LSP product family was developed in collaboration with two major strategic partners. Innovation giant 3M provided key inputs and vital resources to verify the applicability of LSP technology. Semiconductor leader STMicroelectronics provided resources for silicon development, manufacturing and quality assurance for high volume production of LSP devices.
“We are excited to further apply 3M science to advance connectivity while improving patient outcomes,” said Cindy Kent, President and General Manager of 3M Infection Prevention Division.
“We have been working with LifeSignals to industrialize their innovative multi-radio architecture and bring it to market in high volumes while meeting clinical-grade requirements. The LSP is the perfect example of the benefits delivered by the complex combination of ultra-low-power wireless connectivity, highly accurate sensor interfaces, advanced analog features, and an ultra-efficient processing platform,” said Benedetto Vigna, President of Analog, MEMS and Sensors Group, STMicroelectronics.