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Power Management

2023-05-23- Stephen Las Maria

PowerUP Asia 2023 opens tomorrow

AI

2023-05-22- Sarah LaSelva

Artificial intelligence for wireless networks

IP

2023-05-19- Damian Bonicatto and Phoenix Bonicatto

Obtaining a patent in a corporate environment

5G

2023-05-18- Lauro Rizzatti

Developing and verifying 5G designs: A unique challenge

GaN/SiC

2023-05-15- Stephen Las Marias

IDM approach continues to strengthen ST’s semiconductor leadership

Blog

2023-05-12- Brian Dipert

Designing for an uncertain future

Power Management

2023-05-11- Marisol Cabrera, Tomas Hudson, and Marlon Eguia, Monolithic Power Systems

Predictive transient simulation analysis for the GPUs

Power Management

2023-05-08- Bosheng Sun

How to reduce the THD of a PFC

Recommended

EDA

Cadence Expands Collaboration with Arm to Accelerate Mobile Device Silicon Success

Teardown

Disassembling a “dumb phone”

Power ICs

Infineon wireless power transmitter IC suited to charging applications up to 50W

RF/Microwave

Nordic and Onomondo Partner to Bring SoftSIM to Low-power Cellular IoT

Fusion Worldwide Honored at SBR International Business Awards

Wireless and Networking

TMYTEK Showcases XRifle Reflector Solution at Wireless Japan 2023

Hot Topic

Semiconductor

TSMC upends 3nm roadmap with three new nodes

Editor's Choice

GaN/SiC

IDM approach continues to strengthen ST’s semiconductor leadership

Test & Measurement

Keysight Highlights Challenges, Opportunities in Satellite Industry

GaN/SiC

EPC’s Alex Lidow discusses why the power electronics industry should focus on GaN

Fusion Worldwide Honored at SBR International Business Awards

Wireless and Networking

TMYTEK Showcases XRifle Reflector Solution at Wireless Japan 2023

Embedded Systems

Pitfalls when qualifying compiler libraries

GaN/SiC

Industry experts to discuss GaN and SiC technologies at PowerUP Asia

GaN/SiC

GaN and SiC technologies on spotlight at PowerUP Asia conference

Sustainability

STMicroelectronics publishes 2023 Sustainability Report

Processors/Controllers

Toward the future of EVs, intelligent cockpits

Design Ideas

Home solar-supply topologies illustrate tradeoff realities

GaN/SiC

Silicon carbide’s wafer cost conundrum and the way forward

Power Management

Inaugural PowerUP Asia conference highlights latest innovations in Asia’s power electronics industry

Embedded Systems

Why MISRA C matters for embedded system developers

Robotics

NexCOBOT builds x86 functional safety robot control solution

Design Ideas

A small, dedicated battery analyzer design

IC Design

The potential of artificial general intelligence tools for design facilitation

Analog

The difference between BAW and SAW filters

LEARNING STUDIO

Webinars

2022/08/03

MOSFIT: Infineon Automotive MOSFET Riding Innovative Design

Infineon Automotive MOSFET Addressing The Market Development & World Class Quality

Functional Safety and Security in NOR Memories

Calibre Full Chip Integration & Interface flows

XENSIV™ TLE4972 – Infineon coreless current sensor is ideal for xEV applications like traction inverters used in hybrid and battery-driven vehicles, as well as for battery main switches

Downloads

Powering Power Electronics

India’s Steady Progress in Building Its ESDM Ecosystem

IoT: Industry Progress, Insights, Components, and Use Cases

Power: Trends, Drivers, and the Latest Developments in Asia’s Power Semiconductor Industry

Innovative Reed Tech

Special Reports

EMC/EMI/ESD

Design PCBs for EMI

Does 5G Pose Health Risks?

New Products

GaN/SiC

Microchip’s SiC E-Fuse demonstrator offers better power electronics protection in EVs

Wireless and Networking

InPlay launches Bluetooth SoC in WLCSP package

Memory

NEO Semiconductor unveils 3D X-DRAM technology

Wireless and Networking

TI strengthens Wi-Fi connectivity for connected IoT applications

Wireless and Networking

Infineon SoC now ready with Bluetooth 5.4 spec

Embedded Systems

Portwell unveils Intel-powered Nano-ITX embedded board

Controls/MCUs

Artery debuts much-anticipated AT32F423 MCU

GaN/SiC

Nexperia launches 650V SiC diodes for power conversion applications

EDA

Cadence launches AI-powered Virtuoso Studio

Sensors/MEMS

STMicroelectronics automotive inertial module certified to ASIL B

Power Management

STMicroelectronics in-circuit programming/debug probe features extended power-measurement range

Power Management

TI launches stand-alone active EMI filter ICs for high-density power supply designs

GaN/SiC

ST expands GaN family with 100W and 65W VIPerGaN converters

Nexperia

Nexperia ASFETs Enable 60% Footprint Reduction

GaN/SiC

EPC launches rad hard GaN transistors for space applications

Controls/MCUs

Renesas boosts RISC-V embedded processing lineup

Amplifiers/Converters

STMicroelectronics STripFET devices improve FoM by 40%

Power Management

Nexperia energy harvesting PMICs enable up to 90% BOM cost savings

Amplifiers/Converters

ST’s industrial-grade MOSFETs improve FoM by 40%

Controls/MCUs

TI’s latest MCU portfolio makes embedded systems more affordable

People

Supply Chain

Mouser Celebrates 50th Service Anniversary of President & CEO Glenn Smith

GaN/SiC

EPC’s Alex Lidow discusses why the power electronics industry should focus on GaN

GaN/SiC

Industry experts to discuss GaN and SiC technologies at PowerUP Asia

Analog

Alan Lee appointed CTO of Analog Devices

Power

Call on mechanical engineers to solve your tough thermal problems

Electric Vehicles

The road to 800-V EVs

Sensors/MEMS

Molex enabling quieter, smoother EV rides

IP

Arm cements leadership in processor IP space

Processors/Controllers

IP architect Tariq Kurd wins the RISC-V Contributor Award

Controls/MCUs

ARTERY Tech MCU AT32F435/437 Earns Best MCU/Driver IC of the Year Award

Power Management

M3 Technology receives EE Awards for simplifying supercapacitor designs

Memory

Macronix wins back-to-back Memory Product of the Year honors at EE Awards Asia

Opinion

Analog

Chronicle of 10 analog, power and RF acquisitions in 2021

Aerospace

2022 tech themes: A look ahead

Energy

The fundamental problems with ‘traditional’ power transmission

FPGAs

Sky-rocketing chip prices? Not with embedded FPGA

Supply Chain

Don’t underestimate the passives shortage

Analog

Why envelope tracking is both impressive and scary

Blog

The rise of the remote contractor

Amplifiers/Converters

Is Optical Computing in Our Future?

Blog

A well-known numerical “constant” may need revision

Communications

5G is imminent: A roundup of recent activity

Automotive

5G and autonomous vehicles might not go hand-in-hand

Blog

Blog: Expect the Unexpected with Control Systems

Aerospace

Boeing MAX 8: Enhancing Pilot Training With Technology

Consumer Electronics

2020: A consumer electronics forecast for the year(s) ahead

Communications

Consumer electronics: 60 years into the future

Power Management

Do lithium-ion batteries follow Moore’s Law?

Engineering

Mind of the Engineer 2020: Engineering disciplines continue to merge

Consumer Electronics

A high-end display acquisition for photography aspirations

Design IdeasMore +

Squeeze extra resolution from an 8-bit DAC with Shannon decoder idea

Home solar-supply topologies illustrate tradeoff realities

A small, dedicated battery analyzer design

DAC-controlled triangle/sawtooth generator

TeardownMore +

Disassembling a “dumb phone”

Spotify’s Car Thing: “Why does it exist” is the crux of the questioning

Teardown: Ungluing a GaN charger

Freeing a three-way LED light bulb’s insides from their captivity

5GMore +

Artificial intelligence for wireless networks

Developing and verifying 5G designs: A unique challenge

Dynamic vector threading for vRAN, massive MIMO in 5G

Keysight’s technology predictions for 2023

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PowerUP Asia 2023 (May 24-26)

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