With the MIPI D-PHY device, CrossLink ASSP platforms adopt mobile interface technology to optimise cameras and displays with multi-I/O options.
Lattice Semiconductor has released three new CrossLink intellectual property (IP) and two new CrossLink demonstration platforms showcasing MIPI DSI to LVDS and CMOS to MIPI CSI-2 in line with its Lattice CrossLink programmable ASSP (pASSP) solutions to enable new video bridging capabilities.
The CrossLink I/O landscape offers designers performance, power efficiency and compact bridging solutions. Applications of the CrossLink product features interface conversion, merging and mixing of image sensors, application processors and displays.
By optimising and leveraging IP and development platforms, along with additional resources, Lattice simplifies bridging applications by combining the flexibility and productivity of an FPGA with the power and functional optimisation of an ASSP.
Figure 1: One CrossLinkpASSP IP platform feature is its 4:1 MIPI CSI-2 camera aggregator bridge allowing four CSI-2 cameras to be connected to a single CSI-2 interface on the processor.
CrossLink pASSP IP platform features:
CrossLink pASSP demonstration platform features:
Lattice provides bridging solutions for consumer, industrial and automotive applications via CrossLink IP to save logic resources and lower power consumption.