Automotive-grade e-MMC devices support instrument cluster

Article By : Toshiba

Toshiba’s e-MMC parts integrate NAND chips and are fabricated using its 15nm process technology.

Toshiba has introduced the JEDEC e-MMC Version 5.1-compliant embedded NAND flash memory products supporting AEC-Q100 Grade23 requirements. The new product line-up, consisting of densities of 8GB, 16GB, 32GB and 64GB, meets the requirements of the automotive infotainment market.

As consumer demand for connected cars grows, the need to support the data storage demands of increasingly complex automotive applications–for example, ADAS4 and autonomous driving systems grows as well.

In the automotive market, the development of car infotainment–ADAS and autonomous driving systems–has created an increased demand for NAND flash memory. Accelerated processing power and increased data storage capacity are crucial to enabling these new technologies, and Toshiba's e-MMC has emerged as the data storage technology of choice for automotive applications.

Toshiba’s e-MMC parts integrate NAND chips and are fabricated using its 15nm process technology with a controller to manage basic control functions for NAND applications in a single package. The new products enhance Toshiba’s existing line-up of automotive e-MMC devices by offering support for applications such as instrument clusters, which require storage solutions that operate at higher temperatures (up to 105°C).

Toshiba is also currently developing automotive UFS products that will support AEC-Q100. Sample shipments of the new e-MMC devices begin today, with mass production scheduled for the second quarter of 2017.

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