Additions to the library will eliminate the need for 2D mock-ups and reduce the risk of board redesign prior to fabrication, according to AVX.
Interconnect solutions provider AVX has expanded its 3D Model design library for polymer, tantalum and niobium oxide capacitors, allowing engineers to visually simulate and pre-emptively test PCB layout and ensure that populated PCBs will fit within planned enclosures.
The capabilities will eliminate the need for 2D mock-ups and significantly reduce the risk of board redesign prior to fabrication, both of which enable reduced design cycle durations and valuable cost savings, according to the company.
New 3D models for AVX’s polymer, tantalum, and niobium oxide capacitors are available free of charge as part of AVX’s extensive set of design libraries and tools, and are made available as STEP files to facilitate their use in a variety of different CAD systems.
“3D models are an essential design tool for electronics engineers. By allowing users to simulate component layouts in product designs much more accurately than 2D mock-ups before investing time and money into prototype manufacturing and testing, 3D CAD drawings help to conserve valuable resources and enable significantly more first-pass design successes,” said Chris Reynolds, technical marketing manager at AVX.