Smiths Interconnect will use the grant to enhance its Space Qualification Laboratory to assure the quality and durability of space components.
As designated by the Defense Logistics Agency (DLA), the RT PolarFire FPGA from Microchip Technology is now QML Class Q qualified.
Developed in collaboration with AMD, Renesas' reference design integrates key radiation-hardened components for power management.
NASA is collaborating with commercial and international partners, including Keysight Technologies, to establish the first long-term presence on the Moon.
Built around a Teledyne e2v QLS1046-Space edge computing module configured by the rad-hard Infineon SONOS based NOR Flash memory, enables high performance space processing applications.
The collaboration between Airbus and STMicroelectronics is built around SiC and GaN semiconductors for powering aircraft electrification.
Airbus and STMicroelectronics will collaborate on power electronics R&D for future hybrid- and full-electric aircraft.
A second variant of TTTech's and ST's codeveloped chip is being implemented in modules of the Gateway space station, a key part of NASA's Artemis program.
ADI's Apollo MxFE enables next-generation applications in the aerospace and defense, instrumentation, and wireless communications industries.
The space industry has been flying ARM cores for almost a decade, either as IP within an FPGA or ASIC, or as small, low-power, discrete, rad-hard MCUs.