2017-02-17 - Allegro

Three-phase MOSFET driver IC replaces relays in autos

Allegro’s A6862 N-Channel power driver controls the in-phase isolation MOSFETs in automotives.

2017-02-13 - AVX

Chip capacitors exhibit tolerances down to +/-0.01pF

Designed for soldering onto circuit boards, automotive grade Accu-P series capacitors can withstand time and temperature used in wave and reflow methods.

2017-02-09 - Allegro Microsystems

Hall-effect IC boosts auto sensing accuracy

Allegro’s programmable linear Hall-effect sensor's sensitivity covers 1mV/G to 14mV/G over –40°C to 150°C.

2017-01-31 - Graham Prophet

Sensor module offers 1%-accurate I/V measurements

The automotive grade module communicates via an isolated CAN 2.0B interface at up to 500kbit/sec.

- Jan-Bart Picavet

A closer look at ACF benefits

ACF bonding is an alternative for new systems compared to zero insertion force connectors, board-to-board connectors or soldering.

- Jan-Bart Picavet

Why ACF bonding makes reliable ADAS connections

Anisotropic conductive film bonding can be applied to automotive systems where the connections it makes require less space.

2017-01-10 - Renesas Electronics

Prototype ECU targets automated driving systems

The highly automated driving platform has been developed based on an ASIL-D functional safety concept.

2017-01-06 - Maxim Integrated Products

RF to Bits tuner supports global radio standard

The MAX2175 allows baseband processing to be done in software on a Renesas Electronics R-Car H3 SoC.

2017-01-05 - Qualcomm

Data platform steers connected car future

With an integrated X12 LTE modem offering up to Cat 12 speed, the Snapdragon 820Am delivers smarter and better mobile connectivity.

2016-12-23 - Toshiba

Automotive-grade e-MMC devices support instrument cluster

Toshiba’s e-MMC parts integrate NAND chips and are fabricated using its 15nm process technology.