Three-phase MOSFET driver IC replaces relays in autos
Allegro’s A6862 N-Channel power driver controls the in-phase isolation MOSFETs in automotives.
Chip capacitors exhibit tolerances down to +/-0.01pF
Designed for soldering onto circuit boards, automotive grade Accu-P series capacitors can withstand time and temperature used in wave and reflow methods.
Hall-effect IC boosts auto sensing accuracy
Allegro’s programmable linear Hall-effect sensor's sensitivity covers 1mV/G to 14mV/G over –40°C to 150°C.
Sensor module offers 1%-accurate I/V measurements
The automotive grade module communicates via an isolated CAN 2.0B interface at up to 500kbit/sec.
A closer look at ACF benefits
ACF bonding is an alternative for new systems compared to zero insertion force connectors, board-to-board connectors or soldering.
Why ACF bonding makes reliable ADAS connections
Anisotropic conductive film bonding can be applied to automotive systems where the connections it makes require less space.
Prototype ECU targets automated driving systems
The highly automated driving platform has been developed based on an ASIL-D functional safety concept.
RF to Bits tuner supports global radio standard
The MAX2175 allows baseband processing to be done in software on a Renesas Electronics R-Car H3 SoC.
Data platform steers connected car future
With an integrated X12 LTE modem offering up to Cat 12 speed, the Snapdragon 820Am delivers smarter and better mobile connectivity.
Automotive-grade e-MMC devices support instrument cluster
Toshiba’s e-MMC parts integrate NAND chips and are fabricated using its 15nm process technology.