Gear Radio achieves first-pass silicon success using Cadence and UMC certified mmWave reference flow
Gear Radio Electronics successfully taped out an LNA IC on the first pass by adopting Cadence and UMC certified mmWave reference flow.
Cadence design flows now certified for TSMC’s latest N4P and N3E processes
TSMC has certified Cadence's digital and custom/analog design flows for the latest N4P and N3E processes.
Siemens Tessent Multi Die automates 2.5D and 3D chip DFT
Siemens' Tessent Multi-die helps customers speed and simplify critical DFT tasks for next-gen ICs based on 2.5D and 3D architectures.
Electronics Asia Conference 2022 happening next week
With the theme "Gearing Up for Growth: Electronics and Semiconductor Technologies Driving Industry Developments in Asia," EAC 2022 will focus on applications including IoT, wireless technologies, automotive electronics, and the supply chain.
Cadence and Google Cloud collaborating to advance chip design ecosystem
Cadence and Google Cloud are collaborating to accelerate system and semiconductor design with cloud-ready tools.
Key to addressing verification challenges
Here's why specifications are so important for formal verification.
Three trends shaping the future of electronic design automation
As more systems companies move to design their own chips and electronic products, what are the key EDA trends impacting the pace of innovation?
Failed Pulsic bid another setback to China’s EDA ambitions
U.K. regulators have blocked the acquisition of EDA firm Pulsic by a Shanghai-based developer of semiconductor design software solutions.
Keysight extends collaboration with Synopsys on complex RF, mmWave design validation
The collaboration will enable designers to validate complex RF and mmWave design requirements for 5G/6G SoC and subsystem designs in the Synopsys Custom Design Family.
Cadence accelerates delivery, enhances quality of Arm memory products
With Cadence Liberate MX Trio, Arm achieved the accuracy and capacity required to address advanced-node memory characterization challenges.