Edge vision AI adds to connected intelligence theme at embedded world 2023
More edge vision AI but at lower cost and lower energy footprint in integrated systems solutions is what vendors say customers are looking at more and more.
ST provides full STM32 support for Microsoft Visual Studio Code
Access to the STM32 ecosystem, from within VS Code, now makes these features available to even more embedded developers of the wide STM32 community.
embedded world 2023 day 3: TinyML, more security, and final thoughts
Our editors talk about the highlights from Day 3 of embedded world 2023 in Nuremberg, Germany.
embedded world 2023 day 2: IoT, security, RISC-V, and an AI MCU
Our editors discuss highlights from Day 2 of embedded world 2023, including IoT, security, RISC-V plus an exclusive look at ST’s new AI MCU.
embedded world 2023 daily wrap, day 1: edge AI, boards, and software tools
Our editors talk about the highlights from day 1 of embedded world 2023 in Nuremberg, Germany.
Microchip speeds design of FPGA-based satellite systems
Microchip has combined its RT PolarFire FPGA with the development kit and interfaces for evaluating design concepts based on actual in-flight electrical and mechanical characteristics.
New IP bypasses the need for ID enrollment
The new physically unclonable function (PUF) doesn't need extensive enrollment and rebuilding phases to improve quality of ID or key.
Digi-Key and Make launch new Boards Guide and companion AR app
The updated Boards Guide helps students, makers, and professional engineers identify the latest technology available to help bring innovation to life.
India’s ESDM Industry: Challenges, Opportunities, and the Way Forward
Here's a look at India's ESDM industry, challenges, strengths, and opportunities that would propel the country's industry forward.
STMicroelectronics and eYs3D Microelectronics to highlight 3D stereo-vision camera at CES 2023
STMicroelectronics and eYs3D Microelectronics will showcase the results of their collaboration on high-quality machine vision at CES 2023.