onsemi simulation tools bring complex power electronics applications to market faster
onsemi's online simulator tool provides meaningful insights for complex power electronic applications through system-level simulations at an early stage of the development cycle.
New IP bypasses the need for ID enrollment
The new physically unclonable function (PUF) doesn't need extensive enrollment and rebuilding phases to improve quality of ID or key.
How physically aware interconnect IP bolsters SoC design
A physically-aware interconnect IP facilitates optimal network-on-chip (NoC) topology at front-end and speeds up timing closure at the back-end.
Ascon algorithms finalized for lightweight cryptography
NIST is employing Ascon's cryptographic algorithms for securing IoT, sensors, and other small devices with limited resources.
India’s ESDM Industry: Challenges, Opportunities, and the Way Forward
Here's a look at India's ESDM industry, challenges, strengths, and opportunities that would propel the country's industry forward.
India’s VLSI Industry on the Right Track for Growth
With the theme "Semiconductors Driving Disruptive Innovations in Global Digitalization," VLSI Design Conference 2023 will put the spotlight on India's VLSI industry.
Intel Pathfinder for RISC-V unifies platform, adds features
Intel Pathfinder for RISC-V is unifying its Starter and Professional Editions into a single version.
Fundamentals of I3C interface communication
I3C brings a significant increase in the bandwidth of the serial bus while adding a slew of new features like hot-join, IBI, and HDR modes.
Gear Radio achieves first-pass silicon success using Cadence and UMC certified mmWave reference flow
Gear Radio Electronics successfully taped out an LNA IC on the first pass by adopting Cadence and UMC certified mmWave reference flow.
All you need to know about GAA chip manufacturing process
Gate-all-around (GAA) defies performance limitations of FinFET by allowing transistors to carry more current while staying relatively small.