PUFsecurity's PUFcc crypto coprocessor takes care of security-related affairs within a system and allows the CPU to perform its primary functions safely.
TI's efforts in the high-voltage and automotive markets in Taiwan and Southeast Asia have been recognized by the region's engineering community as the company wins in five product award categories at EE Awards Asia 2022.
The resource-optimized compact version requires less than 1,000 LUTs while performance-optimized version achieves a throughput of 40+ Gbps in high-end FPGAs.
IPs undergo multiple revisions due to evolving specifications and managing these changes as the SoC design evolves can become a nightmare.
Arm and Arteris IP are expanding their existing automotive partnership to speed up SoC design innovation with a robust alignment of IPs and automation toolset integration.
The electronic system design (ESD) industry revenue increased by 12.1% YoY to $3.54 billion in Q1 2022, according to the ESD Alliance.
Cadence has expanded its Tensilica ConnX family with the debut of two new DSP IP cores for embedded processing in the automotive, consumer and industrial markets.
Cadence has extended its collaboration with Arm to accelerate mobile device silicon success using its digital and verification tools and the new TCS22.