2021-10-19 - Majeed Ahmad

From FinFET to GAA: Samsung’s fab journey to 3nm and 2nm

Samsung's development of the 3nm gate-all-around (GAA) process is on track and it has already made available the PDK in…

- Paul Slattery

Cost-efficient camera connectivity with Car Camera Bus

Here's a look at the different automotive camera interfaces in terms of cost and performance, and a solution that delivers…

2021-10-18 - Brian Dipert

Teardown: Apple TV (3rd generation)

Step 1: Low BOM cost. Step 2: High sales price. Step 3: Profit! That's Apple's hardware business plan in a…

- Asem Elshimi, Silicon Labs

How wireless commissioning is performed in a smart home: Part 1

You must think of unboxing, configuring, connecting and provisioning when carrying out wireless commissioning in a smart home device.

2021-10-15 - Bill Schweber

Is a concrete rechargeable battery in your future?

There's more to a good rechargeable battery than energy density by volume and weight.

2021-10-14 - Microchip Technology Inc.

Microchip and Acacia partner on enabling market transition to 400G pluggable coherent optics

Microchip and Acacia are partnering to establish an ecosystem to support 400G CFP2-DCO, QSFP-DD and OSFP modules for the 400ZR…

- Nitin Dahad

ITS World Congress: V2X, protecting vulnerable road users, and e-bikes

Various safety scenarios utilizing V2X are on show at ITS World Congress in Hamburg, plus NXP launches new applications processor…

- Majeed Ahmad

The state analog and mixed-signal design talent in 2021

Analog semiconductor companies are not constrained by the lack of growth opportunities but by the availability of analog design engineers.

2021-10-13 - Digi-Key Electronics

Digi-Key inks global partnership with QuickLogic through Digi-Key Marketplace

QuickLogic's low power, multi-core MCUs, FPGAs and embedded FPGAs, and voice and sensor processing devices are now available at the…

- Majeed Ahmad

What’s driving the acquisitions in the analog design realm?

As chip designs combine sensors, analog and digital processing, chipmakers are maneuvering to add design capabilities for combined systems.