The EPC9186 is suitable for applications such as electric scooters, small electric vehicles (EVs), forklifts, and high-power drones.
NEO Semiconductor's 3D X-DRAM is a 3D NAND-like DRAM cell array structure based on capacitor-less floating body cell technology.
Microchip's E-Fuse Demonstrator Board provides EV designers with a faster, more reliable high-voltage circuit protection solution.
Available in 1.1-by-2-by-0.35mm WLCSP, InPlay's NanoBeacon SoC IN100 sets the record as the world's smallest Bluetooth SoC.
TI's new SimpleLink family of Wi-Fi 6 companion ICs help designers implement highly reliable, secure and efficient Wi-Fi connections at an affordable price.
Infineon's AIROC CYW20829 Bluetooth LE system on chip is ready with the newly released Bluetooth 5.4 specification.
Designed with the Intel Atom processors x7000E series, Intel Processor N series, and Intel Core i3 N-series processors, Portwell's NANO-6064 Nano-ITX supports AI acceleration and real-time computing.
Artery Technology's new value-line AT32F423 MCU is powered by Cortex-M4F and features an FPU, along with rich pins and packages for diverse customer demands.
Nexperia's 650V SiC Schottky diode addresses the challenges of demanding high voltage and high current applications.
Cadence's Virtuoso Studio allows more than a 3X improvement in design throughput for today's largest designs.