EPC GaN FET-based motor drive reference design enhances eMobility, high-power drone performance
The EPC9186 is suitable for applications such as electric scooters, small electric vehicles (EVs), forklifts, and high-power drones.
NEO Semiconductor unveils 3D X-DRAM technology
NEO Semiconductor's 3D X-DRAM is a 3D NAND-like DRAM cell array structure based on capacitor-less floating body cell technology.
Microchip’s SiC E-Fuse demonstrator offers better power electronics protection in EVs
Microchip's E-Fuse Demonstrator Board provides EV designers with a faster, more reliable high-voltage circuit protection solution.
InPlay launches Bluetooth SoC in WLCSP package
Available in 1.1-by-2-by-0.35mm WLCSP, InPlay's NanoBeacon SoC IN100 sets the record as the world's smallest Bluetooth SoC.
TI strengthens Wi-Fi connectivity for connected IoT applications
TI's new SimpleLink family of Wi-Fi 6 companion ICs help designers implement highly reliable, secure and efficient Wi-Fi connections at an affordable price.
Infineon SoC now ready with Bluetooth 5.4 spec
Infineon's AIROC CYW20829 Bluetooth LE system on chip is ready with the newly released Bluetooth 5.4 specification.
Portwell unveils Intel-powered Nano-ITX embedded board
Designed with the Intel Atom processors x7000E series, Intel Processor N series, and Intel Core i3 N-series processors, Portwell's NANO-6064 Nano-ITX supports AI acceleration and real-time computing.
Artery debuts much-anticipated AT32F423 MCU
Artery Technology's new value-line AT32F423 MCU is powered by Cortex-M4F and features an FPU, along with rich pins and packages for diverse customer demands.
Nexperia launches 650V SiC diodes for power conversion applications
Nexperia's 650V SiC Schottky diode addresses the challenges of demanding high voltage and high current applications.
Cadence launches AI-powered Virtuoso Studio
Cadence's Virtuoso Studio allows more than a 3X improvement in design throughput for today's largest designs.