PowerUP Asia conference and exhibition highlights the latest technology developments and trends in power electronics, including WBG devices, power semiconductors, and related technologies.
This article summarizes work done by Professor Christina DiMarino and her group at the Virginia Tech CPES on high-density, high-speed 10-kV SiC power module packaging.
Henkel's Loctite Ablestik ATB 125GR is a high-reliability ncDAF suitable for wirebond laminate and lead frame packages.
Here is why the steady march toward 3D ICs and through silicon vias (TSVs) is becoming a brisk jog.
While each of these IC packages comes with its own set of advantages and disadvantages, overall, it is their use that has facilitated a tech revolution.
FPGAs and analog haven't mixed well, but that may be starting to change with new chiplet technology integrating analog blocks.
QFN packages offer myriad advantages, but also bring a new set of testing challenges.
SUSTIO's factory in Penang will increase SIMMTECH's total capacity for semiconductor packaging substrate and PCB by 20 percent.
Tanaka Denshi Kogyo will establish a new plant in Hangzhou, China, for the production of aluminum bonding wires for power semiconductors.
DNP has developed an interposer, a high-performance intermediate device that is expected to play a key role in next-generation semiconductor packaging.