2022-05-27 - Smiths Interconnect

Optimizing production test of QFN-packaged ICs for consumer, automotive, industrial, and power applications

QFN packages offer myriad advantages, but also bring a new set of testing challenges.

2022-05-17 - SIMMTECH

SIMMTECH opens first advanced manufacturing facility in Southeast Asia

SUSTIO's factory in Penang will increase SIMMTECH's total capacity for semiconductor packaging substrate and PCB by 20 percent.

2022-01-12 - ACN Newswire

Tanaka Denshi Kogyo to Establish New Plant in China

Tanaka Denshi Kogyo will establish a new plant in Hangzhou, China, for the production of aluminum bonding wires for power semiconductors.

2021-12-08 - Dai Nippon Printing Co. Ltd

DNP develops interposer for next-gen semiconductor packaging

DNP has developed an interposer, a high-performance intermediate device that is expected to play a key role in next-generation semiconductor packaging.

2021-07-15 - Kedar Patankar

Common packaging and PCB issues for SoCs

This article looks at packaging and PCB issues that impinge on the success of SoC development.

2021-07-08 - Kedar Patankar

Chip design converges with packaging and PCB in SoC era

SoC developers must become system developers to properly integrate analog and digital IP in silicon and handle extraordinary complexity and functionality.