Henkel's Loctite Ablestik ATB 125GR is a high-reliability ncDAF suitable for wirebond laminate and lead frame packages.
While each of these IC packages comes with its own set of advantages and disadvantages, overall, it is their use that has facilitated a tech revolution.
QFN packages offer myriad advantages, but also bring a new set of testing challenges.
SUSTIO's factory in Penang will increase SIMMTECH's total capacity for semiconductor packaging substrate and PCB by 20 percent.
Tanaka Denshi Kogyo will establish a new plant in Hangzhou, China, for the production of aluminum bonding wires for power semiconductors.
DNP has developed an interposer, a high-performance intermediate device that is expected to play a key role in next-generation semiconductor packaging.
SoC developers must become system developers to properly integrate analog and digital IP in silicon and handle extraordinary complexity and functionality.