Inaugural PowerUP Asia conference highlights latest innovations in Asia’s power electronics industry
PowerUP Asia conference and exhibition highlights the latest technology developments and trends in power electronics, including WBG devices, power semiconductors, and related technologies.
SiC power module packaging solutions for MV grid applications
This article summarizes work done by Professor Christina DiMarino and her group at the Virginia Tech CPES on high-density, high-speed 10-kV SiC power module packaging.
Henkel non-conductive die attach film targets high-reliability packaging designs
Henkel's Loctite Ablestik ATB 125GR is a high-reliability ncDAF suitable for wirebond laminate and lead frame packages.
Analog in 3D ICs and TSVs
Here is why the steady march toward 3D ICs and through silicon vias (TSVs) is becoming a brisk jog.
How do BGA, PGA, and LGA differ from each other?
While each of these IC packages comes with its own set of advantages and disadvantages, overall, it is their use that has facilitated a tech revolution.
Why FPGAs and analog haven’t mixed well so far
FPGAs and analog haven't mixed well, but that may be starting to change with new chiplet technology integrating analog blocks.
Optimizing production test of QFN-packaged ICs for consumer, automotive, industrial, and power applications
QFN packages offer myriad advantages, but also bring a new set of testing challenges.
SIMMTECH opens first advanced manufacturing facility in Southeast Asia
SUSTIO's factory in Penang will increase SIMMTECH's total capacity for semiconductor packaging substrate and PCB by 20 percent.
Tanaka Denshi Kogyo to Establish New Plant in China
Tanaka Denshi Kogyo will establish a new plant in Hangzhou, China, for the production of aluminum bonding wires for power semiconductors.
DNP develops interposer for next-gen semiconductor packaging
DNP has developed an interposer, a high-performance intermediate device that is expected to play a key role in next-generation semiconductor packaging.