Henkel non-conductive die attach film targets high-reliability packaging designs
Henkel's Loctite Ablestik ATB 125GR is a high-reliability ncDAF suitable for wirebond laminate and lead frame packages.
Analog in 3D ICs and TSVs
Here is why the steady march toward 3D ICs and through silicon vias (TSVs) is becoming a brisk jog.
How do BGA, PGA, and LGA differ from each other?
While each of these IC packages comes with its own set of advantages and disadvantages, overall, it is their use that has facilitated a tech revolution.
Why FPGAs and analog haven’t mixed well so far
FPGAs and analog haven't mixed well, but that may be starting to change with new chiplet technology integrating analog blocks.
Optimizing production test of QFN-packaged ICs for consumer, automotive, industrial, and power applications
QFN packages offer myriad advantages, but also bring a new set of testing challenges.
SIMMTECH opens first advanced manufacturing facility in Southeast Asia
SUSTIO's factory in Penang will increase SIMMTECH's total capacity for semiconductor packaging substrate and PCB by 20 percent.
Tanaka Denshi Kogyo to Establish New Plant in China
Tanaka Denshi Kogyo will establish a new plant in Hangzhou, China, for the production of aluminum bonding wires for power semiconductors.
DNP develops interposer for next-gen semiconductor packaging
DNP has developed an interposer, a high-performance intermediate device that is expected to play a key role in next-generation semiconductor packaging.
Common packaging and PCB issues for SoCs
This article looks at packaging and PCB issues that impinge on the success of SoC development.
Chip design converges with packaging and PCB in SoC era
SoC developers must become system developers to properly integrate analog and digital IP in silicon and handle extraordinary complexity and functionality.