This article looks at the current state of the RF heterogeneous integrated circuit (HIC) industry and the outlook on the technology in the next few years.
RF SiPs and heterogeneous integrated circuits (HICs) are emerging as venues for creating highly compact assemblies for wireless applications.
STMicroelectronics' ST25R3920B automotive-qualified NFC reader ICs features increased performance and eases product certification.
Infineon is launching a solution that can be used to open and close locks via the mobile phone—without any batteries in the lock.
Intelligent proximity sensors enable users of laptops and tablets to provide optimal connectivity and long battery life, but they must meet SAR compliance.
With the theme "Gearing Up for Growth: Electronics and Semiconductor Technologies Driving Industry Developments in Asia," EAC 2022 will focus on applications including IoT, wireless technologies, automotive electronics, and the supply chain.
Renesas' investment in Jariet will help accelerate its development of RF transceiver solutions.
STMicroelectronics' latest eSIM for M2M communication meets the latest standards for 5G network access, M2M security, and flexible remote provisioning and management.
The 8nm RF design reference flow enhances time-to-results, quality-of-results and cost-of-results for next-generation RF design.