GaN and SiC technologies on spotlight at PowerUP Asia conference
WBG is one of the key focus topics at the upcoming PowerUP Asia conference and virtual exhibition on May 24-26, 2023.
Hitachi High-Tech builds new facility for semiconductor equipment manufacturing
Hitachi High-Tech will construct a new production facility to boost its production capacity for semiconductor equipment.
Inaugural PowerUP Asia conference highlights latest innovations in Asia’s power electronics industry
PowerUP Asia conference and exhibition highlights the latest technology developments and trends in power electronics, including WBG devices, power semiconductors, and related technologies.
Tanaka sets up South Korea subsidiary
Establishing a subsidiary in South Korea will expand Tanaka's business in the markets for fuel cell catalysts and power semiconductor materials, among others.
TSMC’s 3-nm progress report: Better than expected
Taiwan's mega-fab has successfully launched 3-nm process node and its yield is reportedly around 80% for early chips produced for Apple.
What a fab’s tie-up with packaging and test firm means
GF is collaborating with Amkor to bring wafers to OSAT's Porto site in Portugal and help create an at-scale back-end facility.
Ambarella selects Samsung’s 5nm technology for automotive AI controller
Ambarella's integrated CV3-AD685 system-on-chip is built on Samsung Foundry's 5nm technology.
Brewer Science gapfill material enhances advanced-node patterning
Brewer Science's OptiStack PL200 provides superior planarization, solving problems faced in sacrificial gapfill applications.
Mouser Electronics significantly expands line card in 2022
Mouser has added 59 new manufacturers to its line card during 2022, significantly expanding product choices for design engineers and purchasing professionals worldwide.
EEJA showcases latest plating products at 37th INTERNEPCON JAPAN
EEJA is showcasing four new plating technologies and processes for electronic components, semiconductors, and resins at INTERNEPCON JAPAN.