Renesas launches I3C intelligent switch family
Renesas has unveiled the industry’s first I3C intelligent switch devices targeting next generation server motherboards and other infrastructure equipment.
Why Broadcom is acquiring VMware
Is Broadcom acquiring a cash cow or building a vertical stack of components from processor to application? The latter could be highly transformative, but the question of how effective a full stack strategy.
Broadcom to strengthen cloud software capabilities in bid for VMware
At the outset, it seems another attempt to align chipmaker Broadcom to the software side of the rapidly growing data center business.
TSMC targets conversion to 1.4-nm process node in June
TSMC plans to convert its 3-nm process R&D into a 1.4-nm process in June and thus reclaim sub-2-nm leadership from Samsung Foundry.
SIMMTECH opens first advanced manufacturing facility in Southeast Asia
SUSTIO's factory in Penang will increase SIMMTECH's total capacity for semiconductor packaging substrate and PCB by 20 percent.
Chip fab industry makeover
There will be an 8.7% jump in IC industry capacity forecast this year, and it comes primarily from the addition of 10 new 300-mm wafer fabs scheduled to open this year.
TI’s solid-state relays tout industry-leading reliability
TI's new portfolio of solid-state relays can help make EVs safer while reducing solution size up to 90% and cost by as much as 50%.
A look at the impact of Intel’s foundry foray on EDA, IP industries
Like IC design, the EDA and IP industries are an intrinsic part of the IC manufacturing ecosystem spearheaded by semiconductor foundries.
The software-defined vehicle needs hardware that goes the distance
How do we deliver a hardware platform that has the compute capability, flexibility and capacity to handle complex use cases that may not even exist yet?
Disrupt or be disrupted: Intel and the great semiconductor fab game
Find out where Intel stands in its bid to compete with fab business behemoths TSMC and Samsung.