COM-HPC: What developers and users need to know
COM-HPC, the next-generation standard for modular system designs, is complex and sometimes misunderstood. Here's what you need to know.
Use a Smith chart for component characterizations
Applicability of the Smith chart also applies to component characterizations, sometimes with intuitively surprising results.
ROSC for neural network accelerator functional coverage
While the RISC (reduced instruction set computer) design philosophy has changed the face of computing forever, this article presents a…
Understanding how bimetallic strips work
Bimetallic strips can be useful for making thermometers and thermostats, or for providing temperature compensation for other devices.
Adoption of Li-Fi systems set to grow
The growing adoption of Li-Fi systems across the education sector is anticipated to propel the global Li-Fi market share over…
Wireless MCUs add Bluetooth 5.0 long-range capabilities
A trio of wireless MCUs from NXP add Bluetooth 5.0 long-range capabilities and robust serial communications.
Use waveform math to extend the capabilities of your DSO or digitizer
See how math operations can be used to extend the functionality of a digital oscilloscope or digitizer.
Understand the damaging effects of phase dispersion
A study of AM signals is a convenient tool for showing a damaging effect arising from phase dispersion.
Multi-patterning strategies for navigating the sub-5 nm frontier, part 3
Determine the best self-aligned multi-patterning process solution for your advanced node applications.
DOE lighting workshop explores lighting science and systems
This year’s DOE Lighting R&D Workshop covered topics like lighting for plants and human health, and integration of lighting and…