Comchip adapted WLCSP technology in diode product (Wafer Level Chip Scale Package)

Sponsor : Comchip

Comchip was focus on ultra-small diode assembly technology development for a
decade. Now we are very happy to introduce the brand new ultra-small diode package
technology, so call Full-pack WLCSP. It’s the smallest diode in the world, DFN0402
(01005) package. Comchip’s WLCSP is a full package with 6 sides epoxy protection. It’s
different from normal WLCSP bare die parts or two side epoxy protection parts.

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