EPC rad-hard transistor targeted at demanding space applications
Article By : Efficient Power Conversion (EPC)
EPC has expanded its family of radiation-hardened gallium nitride products with the release of the EPC7007 GaN FET.
Efficient Power Conversion (EPC) has expanded its family of radiation-hardened (rad-hard) gallium nitride (GaN) products with the release of the EPC7007 GaN FET.
The EPC7007, a 200V, 25mΩ, 80APulsed, rad-hard GaN FET in a small 5.76mm2 footprint. The EPC7007 has a total dose rating greater than 1 Mrad and SEE immunity for LET of 85 MeV/(mg/cm2). These devices are offered in a chip-scale package, the same as the commercial eGaN FET and IC family. Packaged versions will be available from EPC Space.
Compared to rad-hard silicon devices with similar RDSon, the EPC7007 offers 40 times smaller QG and QGD, zero reverse recovery (QRR). and the size is 40 times smaller. With higher breakdown strength, lower gate charge, lower switching losses, better thermal conductivity, and very low on-resistance, power devices based on GaN significantly outperform silicon-based devices and enable higher switching frequencies resulting in higher power densities, higher efficiencies, and more compact and lighter weight circuitry for critical spaceborne missions. GaN devices also support higher total radiation levels and SEE LET levels than silicon solutions.
Applications benefiting from the performance and fast deployment of the EPC7007 include DC-DC power, motor drives, lidar, deep probes, and ion thrusters for space applications, satellites, and avionics.
“EPC’s GaN technology enables a new generation of power conversion and motor drives in space operating at higher frequencies, higher efficiencies, and greater power densities than ever achievable before. The EPC7007 offers designers a solution with a figure of merit that is 50 times better than best-in-class silicon rad hard devices,” said Alex Lidow, CEO, and co-founder of EPC. “The EPC7007 extends the voltage range of our rad hard family to 200 V and provides designers with a solution that is significantly smaller and lower cost than silicon.”
