Industry experts to discuss GaN and SiC technologies at PowerUP Asia

Article By : EDN Asia

A panel of industry experts will discuss the challenges that engineers currently face in a variety of application contexts for GaN and SiC technologies.

The wide-bandgap (WBG) market has experienced expansion and rising industrial acceptance. As technology advances, businesses are creating a wide range of products that offer advantages in a number of applications for the industrial, automotive, and consumer industries, among others.

WBG semiconductors such as gallium nitride (GaN) and silicon carbide (SiC) are supplying the market with the proper input by offering fresh solutions to the challenges that designers confront in an era where “efficiency” is the watchword.

At the inaugural PowerUP Asia conference, a panel of industry experts will discuss the challenges that engineers currently face in a variety of application contexts for GaN and SiC technologies and devices, as well as the obstacles that still need to be removed for widespread adoption, to produce improved performance and lower costs that will benefit the industry as a whole.

With the theme “Recent Advances and Upcoming Challenges for Wide Bandgap Semiconductors,” the panel discussion will be moderated by Eng. Maurizio Di Paolo Emilio, Ph.D., Editor-in-Chief of Power Electronics News and EEWeb, will feature the following panelists:

  • Andrea Bricconi, CCO, Cambridge GaN Devices
  • Thierry Bouchet, CEO, Wise Integration
  • Stephen Coates, General Manager (Asia) and VP of Global Operation, GaN Systems Inc.
  • Amitava Das, Co-Founder & COO, Tagore Technology
  • Pete Losee, Director of Technology Development, Qorvo Inc.
  • Francesco Muggeri, Vice President of Marketing & Applications, Power Discrete & Analog, APeC/China, STMicroelectronics

WBG is one of the key focus topics at the upcoming PowerUP Asia conference and virtual exhibition on May 24-26, 2023. Organized by AspenCore, the publisher of EETimes Asia, EETimes India, and EDN Asia, PowerUP Asia puts the spotlight on the key players and the latest technologies and trends in the power electronics industry in Asia.

PowerUP Asia builds on the success of the established PowerUP Expo, a virtual conference and exhibition being held by Power Electronics News, a sister publication under AspenCore.

For more information and to register, visit https://ve.eetasia.com/powerup2023.

 

Virtual Event - PowerUP Asia 2024 is coming (May 21-23, 2024)

Power Semiconductor Innovations Toward Green Goals, Decarbonization and Sustainability

Day 1: GaN and SiC Semiconductors

Day 2: Power Semiconductors in Low- and High-Power Applications

Day 3: Power Semiconductor Packaging Technologies and Renewable Energy

Register to watch 30+ conference speeches and visit booths, download technical whitepapers.

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