Low-power Wi-Fi chipset enables precise tracking solution

Article By : Infineon Technologies AG

Infineon and Deeyook are collaborating on ultra-precise location solution.

Infineon Technologies AG is integrating Deeyook’s ultra-precise, innovative algorithms into its low-power AIROC Wi-Fi portfolio to enable an accurate, passive, ubiquitous, and efficient location solution.

Deeyook redefines indoor/outdoor location technology through innovation in wireless signal processing, applicable to incumbent Wi-Fi/4G/5G MODEM firmware versions. The firmware extracts angles of wireless transmissions (Direction Finding, DF), a first of its kind in the world of commercial wireless tracking. Deeyook’s tracking capabilities are ultra-precise, providing location information within 10cm/4in, passively exploiting the install base of 1.7 billion wireless access points worldwide.

“There are many challenges when companies implement real-time location systems, primarily because tracking solutions, such as RFID, are not really ubiquitous. This is particularly acute with GPS, which has many shortcomings,” said Gideon Rottem, CEO and Co-Founder of Deeyook. “We created Deeyook to address these challenges—technology that is ubiquitous and can track things with the utmost precision indoors, outdoors and in bad weather. We are excited to work with Infineon because its AIROC Wi-Fi portfolio is reliable, power efficient, and they are the IoT market leader.”

“Infineon’s mission is to make the world an easier, safer and greener place with our technologies through smart, connected devices,” said Sivaram Trikutam, Senior Director, IoT Compute and Wireless, Infineon Technologies. “These new IoT solutions support multiple location tracking technologies. Previously, Wi-Fi was not considered a viable option due to its power demands, while additionally real-time locating systems (RTLS) deployments required businesses to utilize custom solutions with costly infrastructure, engineering, and labor-intensive installation.”

Deeyook’s solution paved the way to solve all these problems. Embedded in the next-generation chip firmware, it has the potential to be a market leader in RTLS. With this collaboration, Infineon continues to expand its role as a key Industry 4.0 solution vendor to the world’s largest corporations.

 

Virtual Event - PowerUP Asia 2024 is coming (May 21-23, 2024)

Power Semiconductor Innovations Toward Green Goals, Decarbonization and Sustainability

Day 1: GaN and SiC Semiconductors

Day 2: Power Semiconductors in Low- and High-Power Applications

Day 3: Power Semiconductor Packaging Technologies and Renewable Energy

Register to watch 30+ conference speeches and visit booths, download technical whitepapers.

Leave a comment