Telink Semiconductor and Ixys Corporation have signed an agreement to jointly target the growing IoT market.
Fabless integrated circuit design company Telink Semiconductor has teamed up with Ixys Corporation to address the growing IoT market.
The companies' initial plan includes addressing address geographies such as Korea, Japan and Europe, leveraging IXYS’ channels and sensor technologies, and Telink’s unified IoT system-on-chip solutions.
Founded in 1983, Ixys Corporation has been developing technology-driven products to improve power conversion efficiency, generate clean energy, improve automation and provide advanced products–and has over 3,500 customers in the transportation, medical and telecom industries. Ixys is a pioneer in the development of power semiconductors, integrated circuits and RF systems that effectively monitor electrical voltage to produce maximum effect with least expenditure of energy.
Telink Semiconductor, meanwhile, is focused on IoT chipset solutions for smart homes, with a product portfolio that addresses all major communications protocols including Bluetooth Smart, ZigBee, 6LoWPAN/Thread and HomeKit. The company has a leading position in Bluetooth low energy (BLE) mesh-based solutions, with annual sales of over RMB 100 million and major customers such as GE, Philips and Cisco.
Telink CEO Wenjun Sheng said the partnership "will allow us to extend the reach of networked small devices for the home and industrial markets, as well as strengthen Ixys’s product portfolio."