Ansys has collaborated with TSMC to deliver a suite of design solutions for TSMC's 7nm and integrated fan-out (InFO) packaging technology.

Ansys said TSMC has certified its solutions for the 7nm node, including Ansys RedHawk, Ansys Totem, Ansys HFSS and Ansys Slwave to perform a variety of multi-die analyses including extraction, power and reliability, signal and power integrity, and thermal and electromagnetic interference.

The certification allows mobile and IoT manufacturers to create cost-effective, thinner and highly reliable products, and enables computing and automotive designers to create reliable, energy efficient high-performance chips–optimised for electromigration and thermal effects, and operating continuously in mission critical equipment with Ansys’ fully validated integrated circuit and package-level solutions, according to the company.