2020-06-12 -

Electronic Packaging for MEMS Infrared Sensor With Filtered Optical Window

Sensor developments involving semiconductors techniques are even more becoming a typical vehicle for high-level of integration and in many cases are constituting a solid base for a dedicated category of Micro Electro Mechanical Systems (MEMS). In the present paper the package structure along with the System in Package (SIP) assembly details for an optical MEMS […]