Technical Document

2020-06-12 -

Electronic Packaging for MEMS Infrared Sensor With Filtered Optical Window

Sensor developments involving semiconductors techniques are even more becoming a typical vehicle for high-level of integration and in many cases are constituting a solid base for a dedicated category of Micro Electro Mechanical Systems (MEMS). In the present paper the package structure along with the System in Package (SIP) assembly details for an optical MEMS […]

2020-02-21 -

Important things to know about NG eCall

On 31 March 2018, all new European cars must have eCall to guarantee immediate assistance to motorists involved in serious collision. With mobile operators switching off the GSM network soon, next generation eCall (NG eCall) running on LTE network is coming up next. The advantage – fast, robust solution, high data rate, easily extensible, no […]

2020-02-21 -

Gate Drive Measurement Considerations

Gate driver enables power switches to turn on and off faster, improving the rise and fall times. Fast switching means higher efficiency and higher power density, reducing losses in power stage associated with high slew rates. However, as slew rates increse, challenges in measurement and characterization uncertainty increases too. Read this whitepaper for effective measurement […]

2020-02-21 -

Introduction to the vehicle-to-everything communications service V2X feature in 3GPP release 14

The intelligent transportation system (ITS) has a clear objective to improve the overall traffic efficiency. This started the idea of V2X (vehicle-to-everything), an end-to-end digitization initiated by a single vehicle through all elements of transportation system from the road infrastructure to backend server providing general basis for continuos control and management of traffic flow.Read this […]

2020-01-15 -

SiC-based MOSFETs offer dramatic benefits in automotive, power applications

As conventional silicon-based MOSFETs mature, they are now reaching their theoretical limits of performance. Wide band-gap semiconductor devices represent an interesting alternative for improving performance due to their electrical, thermal, and mechanical properties. The admin of this site has disabled the download button for this page.

2019-12-26 -

4 ways to make component characterization more efficient

Want help speeding up component test? Improving test efficiency is one easy way to shorten your design or manufacturing timeline. It could make a difference when bidding on contracts or committing to delivery schedules. Learn about four network analyzer capabilities that make next-generation testing significantly more efficient in our eBook. Conduct time domain analysis, spectrum […]

2019-12-26 -

Make Your Factories Smarter – Industry 4.0

Make smart factories smart – use data analytics to maximize throughput, minimize downtime, and reduce expenses. Industry 4.0 is all about optimizing business processes through the application of digital technologies and workflows. A successful smart factory connects essential technologies across the organization with strategic partners — all driving efficiency and productivity. Read this white paper […]