SECORA ID S security for electronic ID cards
Article By : Infineon Technologies
Infineon Technologies offers an easy-to-integrate security platform for contactless digital ID documents. The first product variant, SECORA ID S, is a particularly flexible, Java-based solution...
With SECORA ID, Infineon Technologies offers an easy-to-integrate security platform for contactless digital ID documents. The first product variant, SECORA ID S, is a particularly flexible, Java-based solution. It simplifies and accelerates the design and production of region-specific sovereign documents such as eIDs in card format. The solution includes the security chip, the operating system and applets while meeting the increased security requirements of sovereign applications: chip and operating system are certified according to Common Criteria EAL 6+.
As a system solution, SECORA ID S offers many advantages:
- The security chip SLC52G provides highest protection of the individual data of the card holder and a storage capacity of up to 800 kByte.
- The chip was developed at Infineon’s competence center for contactless technologies in Graz, Austria; it offers outstanding performance for contactless data transfer.
- The Java Card Standard v3.0.5 software facilitates and accelerates development and testing of electronic ID cards.
- Customized applets accelerate the personalization of the documents.
- Thanks to Infineon’s Coil-on-Module chip package technology cards become more robust and their production more cost-efficient. The chip is glued and no longer soldered to the card hence eliminating vulnerable soldering points. The cards are valid for a relatively long time and in daily use become significantly more durable. Additionally, smaller card manufacturers can use existing production facilities for contact-based cards without major investments.
SECORA ID S with the Infineon eMRTD applet (CC EAL5+) especially for machine-readable travel documents is available now. Further applets from the Infineon Applet Collection and from Masktech GmbH will follow in the second half of the year.