ATP Electronics
2022-03-09 - ATP Electronics

New die package extends ATP’s 3D TLC e.MMC endurance to MLC/SLC levels

ATP Electronics has introduced its latest line of e.MMC devices built on 3D triple level cell (TLC) NAND.

Aspencore Network
Products:
News & Analysis:
Design:
Tools:
Global Network
For Advertisers
All contents are Copyright © 2023 by AspenCore, Inc. All Rights Reserved.
About Us Privacy Policy Terms of Use Site Map