2016-07-21 - Murata

Compact LoRa module operates in up to 915MHz spectrum

The MCU includes 192kB flash and 20kB RAM, and has enough memory to embed customer applications and host other modulation…

2016-07-21 - Kevin Gibb

Samsung S7’s two image sensors: What’s the difference?

TechInsights discuss which wafer bonding technology hints at a possible future for stacked dies.

2016-07-21 - Kevin Gibb

Samsung S7’s two image sensors: What’s the difference?

TechInsights discusses which wafer bonding technology hints at a possible future for stacked dies.

2016-07-18 - Rick Merritt

IoT gets stitched: Printed inks, conductive yarns on the way

Two companies are working to identify materials, connectors and techniques to fill in the gaps between making electronics and fabrics.

2016-07-15 - Brian Di[pert

Consumer electronics: 60 years into the future

In this article, we take a look into the future- to the overarching themes and specific technologies that will be…

2016-07-13 - Julien Happich

Zinc doping makes GaAs nanowire lasers shine

Gallium arsenide is used in smartphones and other electronic devices, but GaAs nanowires require surface passivation to minimise surface defects.

2016-07-04 - Toshiba

Built-in LDO, daisy-chain pins trim LED modules

In a typical system, power supply has to be supplied to LED driver ICs and LEDs separately. Using the new…

2016-07-04 - Cabe Atwell

Editor’s picks: 10 Engineering projects you can do

From robotics to submarine ROVs and beyond, we put together the top 10 projects engineers of all skill levels can…

2016-07-01 - STMicroelectronics

Battery-charger chip saves board space in wearables

The highly integrated STBC02 IC combines all of the most frequently demanded features for energy management in wearable and portable…

2016-06-30 - NXP

Plug-and-play controller integrates NFC in OS-based systems

Equipped with embedded firmware, the PN7150 enables easy integration of NFC functionality in OS-based systems via the NCI interface.