2020-09-28 - Keith Felton

A new approach to IC packaging design

IC packaging needs a new approach for design and verification at all levels to enable designers to manage processes in…

2020-08-04 - Nitin Dahad

AI-based substrate calibration tool accurately predicts failures

Paris-based EDA startup Intento Design has introduced an artificial-intelligence (AI) based tool that calibrates the extracted substrate model for any…

2020-07-27 - Cadence, UMC

Cadence and UMC certify mmWave reference flow on 28HPC+ process

Collaboration enables customers to utilize Cadence RF solutions to design 5G, IoT and automotive applications on UMC’s 28nm process technology...

2020-06-03 - Mathias Fritzson

Software-defined automobiles: An efficient platform for essential parallelization

Are we at a critical juncture in how the industry moves forward with software-defined automobiles? As automotive functionality increases and…

2019-06-14 - Lauro Rizzatti

AI to Reshape the Semiconductor Industry

It just makes sense that we will find a lot of applications where we can use the power of AI…

2019-05-13 - Keith Sabine, Product Manager, Pulsic

Analog Layout Automation

There has been vast progress in digital layout automation, which has made it possible to develop complex digital ICs quickly.…

2019-04-15 - Robert Schweiger

Smart sensors to improve ADAS designs

By preprocessing sensor data, smart sensors alleviate the power and data rate drain that occurs when all sensor data...

2017-12-25 - Mike Andrews

Portable stimulus in high-level synthesis flow

Portable stimulus helps bring advanced verification capabilities to a C-based high-level verification environment.

2017-11-23 - Christopher Clee, Mentor Graphics

Parasitic extraction at advanced nodes

Solving speed/accuracy trade-offs at advanced nodes remains a challenge.