A new approach to IC packaging design
IC packaging needs a new approach for design and verification at all levels to enable designers to manage processes in…
AI-based substrate calibration tool accurately predicts failures
Paris-based EDA startup Intento Design has introduced an artificial-intelligence (AI) based tool that calibrates the extracted substrate model for any…
Cadence and UMC certify mmWave reference flow on 28HPC+ process
Collaboration enables customers to utilize Cadence RF solutions to design 5G, IoT and automotive applications on UMC’s 28nm process technology...
Software-defined automobiles: An efficient platform for essential parallelization
Are we at a critical juncture in how the industry moves forward with software-defined automobiles? As automotive functionality increases and…
AI to Reshape the Semiconductor Industry
It just makes sense that we will find a lot of applications where we can use the power of AI…
Analog Layout Automation
There has been vast progress in digital layout automation, which has made it possible to develop complex digital ICs quickly.…
Smart sensors to improve ADAS designs
By preprocessing sensor data, smart sensors alleviate the power and data rate drain that occurs when all sensor data...
Portable stimulus in high-level synthesis flow
Portable stimulus helps bring advanced verification capabilities to a C-based high-level verification environment.
Parasitic extraction at advanced nodes
Solving speed/accuracy trade-offs at advanced nodes remains a challenge.