The novel routing scheme with decoupled power and signal wiring acts as a scaling booster for future logic technologies (2nm…
TSMC plans to convert its 3-nm process R&D into a 1.4-nm process in June and thus reclaim sub-2-nm leadership from…
Apple's lawsuit claims that Rivos has committed trade secret theft of its homegrown chip designs.
Find out where Intel stands in its bid to compete with fab business behemoths TSMC and Samsung.
Lam Research's Syndion GP allows chipmakers to develop next-gen power devices and power management ICs using deep silicon etch technology.
Samsung Foundry has achieved high silicon correlation with the jointly developed solution built on Synopsys PrimeTime signoff technology and Ansys…
Streaming data from firmware and displaying it on an oscilloscope can be a powerful tool and can speed up the…
Data converter IP suppliers are cobbling strategic relationships with SoC designers while qualifying their offerings for foundry processes.
Omni Design and EnSilica will work together to service the needs of customers who are developing the next generation of…
With advanced chip design going into billions of gates on advanced nodes, dozens if not hundreds of engineers have to…