AMD acquiring Xilinx to boost data center offerings
AMD is reportedly acquiring FPGA design house Xilinx to boost its server and data center chip offerings.
10 basic terms for advanced IC packaging
Here is a brief synopsis of the 10 most common terms used in advanced IC packaging technologies.
Advanced packaging could help solve chip I/O limitations
Advanced techniques such as FOWLP allow increased component density as well as boost performance and help solve chip I/O limitations.
Package and system designer collaboration will maximize system performance
Advanced packaging technologies improve performance of heterogeneously integrated IPs on package and help scale bandwidth between die-to-die links on package.
A new approach to IC packaging design
IC packaging needs a new approach for design and verification at all levels to enable designers to manage processes in…
Heterogeneous integration enables advanced IC packaging
Heterogenous integration technology enables semiconductor device manufacturers to combine components into a single composite device with complex and advanced functionality
FPGAs aid hardware acceleration for embedded designs
Fabricated on a 16-nm process node, Efinix Trion Titanium FPGAs incorporate the company’s Quantum fabric for compute acceleration, machine learning,…
Low-power FPGAs deliver twice the I/O density
General-purpose FPGAs in Lattice’s Certus-NX family deliver twice the I/O density per mm2 compared to similar FPGAs in packages as…
Single-function analog ICs solve problems without giving headaches
There’s a need for single-function analog ICs to crisply solve specific problems...
Scrubbing SRAM-based FPGAs to prevent the accumulation of SEUs
SRAM-based FPGAs are increasingly being used in-orbit, and if an essential bit is flipped, the consequences could be catastrophic.